PCB/FPC/RFPC制程
                                                                                              技术能力Technical Capability
项目批量样品
层数2-68L120L
最大板厚10mm(394mil)14mm(551mil)
最小线宽间距内层50/50um40/40um
外层65/65um50/50um
对位能力同张芯板对位±25um±20um
层间对位±4.5mil±4mil
最大铜厚6oz30oz
孔径机械钻孔≥0.15mm(6mil)≥0.1mm(4mil)
激光钻孔0.1-0.35mm0.05-0.35mm
最大尺寸单板850mmX570mm1000mmX570mm
(完成尺寸)背板1250mmX570mm1320mmX570mm
厚径比单板20:127:1
(完成孔径)背板2532
材料无铅/无卤EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W,EM285,TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF
高速Megtron4, TU872SLK, FR408HR,N4000-13Series, S7439C,TU863+,Megtron6, MW2000, IT968,EM891,Megtron7,MW4000,TU933,DS7409DVN,IT988GSE
高频Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY系列,AD系列,RT6002
其他Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,ST115
表面处理喷锡,化学镍金,化学锡,OSP,化学银,金手指,电镀硬金/软金,选择性OSP,化学镍钯金
射频产品/微带线精度线宽±0.8mil/±0.5mil±0.6mil/±0.5mil
线长±1.5mil/±1.2mil±1.2mil/±1mil
金属基结构Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U),局部导电胶
High Density Interconnect Capability结构Max Layer count( any layer)18LMax Layer count( any layer)18L/20L
Min Blind via size (mm)0.1mm/0.075mm0.075mm/0.075mm
外层线宽/间距65/65um 50/50um50/50um 40/40um
Rigid-Flex Capability结构Book, Air-gap, Fly-tail, Unsymmetrical, Semi-flex
Flex Layer Count max.Max Layer count( any layer)12LMax Layer count( any layer)14L
Impedance Tolerance+/-10%+/-8%
Flex Core Thk (Exclude copper) (um)2012.5
Flex outline to Pattern tolerance(mm)+/-0.1+/-0.05
Finished BD thk (mm)0.075 ~0.250.075 ~0.25
材料杜邦AP,AK,松下RF-777,联茂IF, LCP, Tk
FPC1L,2L1L,长度5000米,2L长度46米(2oz),OSP1L,长度5000米,2L长度46米(2oz),OSP
产品及技术路线图Roadmap产品2019/2020
产品20192020
批量/样品批量/样品
背板层数68L/120L68L/120L
完成尺寸1250mmX570mm/1320mmX570mm1250mmX570mm/1320mmX570mm
厚度10mm/14mm10mm/14mm
厚径比(0.31mm成孔)25/3225/35
厚径比(0.36mm成孔)27/3327/33
单板层数32L/36L36L/36L
外层线宽/间距3mil/3mil 2.5mil/2.5mil3mil/3mil  2.5mil/2.5mil
内层线宽/间距2.2mil/2.2mil   2mil/2mil2.2mil/2.2mil   2mil/2mil
厚径比(0.20mm成孔)20/25:122/25:1
厚径比(0.25mm成孔)21/27:124/27:1
阻抗公差±7%/±5%±5%/±5%


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