技术能力Technical Capability | |||
项目 | 批量 | 样品 | |
层数 | 2-68L | 120L | |
最大板厚 | 10mm(394mil) | 14mm(551mil) | |
最小线宽间距 | 内层 | 50/50um | 40/40um |
外层 | 65/65um | 50/50um | |
对位能力 | 同张芯板对位 | ±25um | ±20um |
层间对位 | ±4.5mil | ±4mil | |
最大铜厚 | 6oz | 30oz | |
孔径 | 机械钻孔 | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
激光钻孔 | 0.1-0.35mm | 0.05-0.35mm | |
最大尺寸 | 单板 | 850mmX570mm | 1000mmX570mm |
(完成尺寸) | 背板 | 1250mmX570mm | 1320mmX570mm |
厚径比 | 单板 | 20:1 | 27:1 |
(完成孔径) | 背板 | 25 | 32 |
材料 | 无铅/无卤 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W,EM285,TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF | |
高速 | Megtron4, TU872SLK, FR408HR,N4000-13Series, S7439C,TU863+,Megtron6, MW2000, IT968,EM891,Megtron7,MW4000,TU933,DS7409DVN,IT988GSE | ||
高频 | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY系列,AD系列,RT6002 | ||
其他 | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,ST115 | ||
表面处理 | 喷锡,化学镍金,化学锡,OSP,化学银,金手指,电镀硬金/软金,选择性OSP,化学镍钯金 | ||
射频产品/微带线精度 | 线宽 | ±0.8mil/±0.5mil | ±0.6mil/±0.5mil |
线长 | ±1.5mil/±1.2mil | ±1.2mil/±1mil | |
金属基 | 结构 | Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U),局部导电胶 | |
High Density Interconnect Capability | 结构 | Max Layer count( any layer)18L | Max Layer count( any layer)18L/20L |
Min Blind via size (mm) | 0.1mm/0.075mm | 0.075mm/0.075mm | |
外层线宽/间距 | 65/65um 50/50um | 50/50um 40/40um | |
Rigid-Flex Capability | 结构 | Book, Air-gap, Fly-tail, Unsymmetrical, Semi-flex | |
Flex Layer Count max. | Max Layer count( any layer)12L | Max Layer count( any layer)14L | |
Impedance Tolerance | +/-10% | +/-8% | |
Flex Core Thk (Exclude copper) (um) | 20 | 12.5 | |
Flex outline to Pattern tolerance(mm) | +/-0.1 | +/-0.05 | |
Finished BD thk (mm) | 0.075 ~0.25 | 0.075 ~0.25 | |
材料 | 杜邦AP,AK,松下RF-777,联茂IF, LCP, Tk | ||
FPC | 1L,2L | 1L,长度5000米,2L长度46米(2oz),OSP | 1L,长度5000米,2L长度46米(2oz),OSP |
产品及技术路线图Roadmap产品2019/2020 | |||
产品 | 2019 | 2020 | |
批量/样品 | 批量/样品 | ||
背板 | 层数 | 68L/120L | 68L/120L |
完成尺寸 | 1250mmX570mm/1320mmX570mm | 1250mmX570mm/1320mmX570mm | |
厚度 | 10mm/14mm | 10mm/14mm | |
厚径比(0.31mm成孔) | 25/32 | 25/35 | |
厚径比(0.36mm成孔) | 27/33 | 27/33 | |
单板 | 层数 | 32L/36L | 36L/36L |
外层线宽/间距 | 3mil/3mil 2.5mil/2.5mil | 3mil/3mil 2.5mil/2.5mil | |
内层线宽/间距 | 2.2mil/2.2mil 2mil/2mil | 2.2mil/2.2mil 2mil/2mil | |
厚径比(0.20mm成孔) | 20/25:1 | 22/25:1 | |
厚径比(0.25mm成孔) | 21/27:1 | 24/27:1 | |
阻抗公差 | ±7%/±5% | ±5%/±5% |
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